Publications
CONFERENCE (INTERNATIONAL) Demonstrating FoodSkin: A Method for Creating Electronic Circuits on Food Surfaces by Using Edible Gold Leaf for Enhancement of Eating Experience
Kunihiro Kato (Tokyo University of Technology), Ami Motomura (Ochanomizu University), Kaori Ikematsu, Hiromi Nakamura (The University of Tokyo), Yuki Igarashi (Ochanomizu University)
The ACM CHI Conference on Human Factors in Computing Systems (CHI2023)
April 19, 2023
In this demonstration, we introduce FoodSkin, a method for fabricating an electronic circuit on food surfaces by using edible gold leaf. The circuit is easily fabricated using three readily available materials: gold leaf, water, edible paper, and potato starch. Previous methods for enhancing the eating experience, including the presentation of an electrical taste, by making food part of an electronic circuit are difficult to apply to foods with low water content because of their low conductivity. Our method enables the incorporation of dry foods into an electronic circuit by using edible gold leaf to form a circuit on the surface of the food. FoodSkin thus contributes to expanding the design space of the computer-augmented dining experience. We demonstrate the use of FoodSkin for three applications: controlling food taste through electrical stimulation, controlling food temperature, and providing auditory feedback when eating sweets.
Paper : Demonstrating FoodSkin: A Method for Creating Electronic Circuits on Food Surfaces by Using Edible Gold Leaf for Enhancement of Eating Experience (external link)