CONFERENCE (INTERNATIONAL) Paper-Woven Circuits: Fabrication Approach for Papercraft-based Electronic Devices
Kunihiro Kato (Tokyo University of Technology), Kaori Ikematsu, Yuki Igarashi (Meiji University), Yoshihiro Kawahara (The University of Tokyo)
The 16th Annual Conference on Tangible, Embedded and Embodied Interaction (TEI 2022)
February 14, 2022
In this pictorial, we propose an approach to integrate electronics into a paper-woven craft. A paper-woven structure is formed by alternately and orthogonally weaving paper strips. The key idea is to add conductive layers to these strips by printing or transferring conductive materials. Our approach enables us to form the skeleton of an object and its wiring and sensor arrangement simultaneously. We explore the creative space of this approach, i.e., integrating functions such as sensing, display, and sound amplification into objects, for leveraging the paper-woven structure. We also outline the workflow of the approach, introduce a design support tool, and discuss example applications that combine the electronic-enabled functionality and woven structure.
Paper : Paper-Woven Circuits: Fabrication Approach for Papercraft-based Electronic Devices (external link)